On the morning of April 1, 2015, the Ground Breaking Ceremony of SAMSUNG Electronics HCMC CE Complex, the package of reinforced concrete execution (Package 1 and 4), was held at Block I-11, D2 Street, High Tech, Tang Nhon Phu B Ward, District 9, Ho Chi Minh. Attending the groundbreaking ceremony were representatives of the Owner, Supervisory Consultant, Main Contractor SAMSUNG Engineering and Contractor TAKCO.

SAMSUNG Electronics HCMC CE Complex works with an area of ​​67,088 square meters. TAKCO is honored to be the first contractor to build Package 1 and 4 in the project, contract value of VND 182.809 billion.

Speaking at the ceremony, TAKCO contractor committed to the project owner will mobilize the best resources of the company to complete the project on schedule, ensuring quality, safety, efficiency and responsiveness. Technical and artistic requirements and compliance with the regulations of the State, as well as other conditions entered into in the contract. It is expected to be completed by the end of September 2015 after six months of construction.

Some photos of the project :